Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 69
... foamed MSSQ thin films , since large or highly interconnected pores allow contaminants to diffuse between devices , often resulting in electrical shorts . We describe herein the properties of nanoporous MSSQ foamed from organic ...
... foamed MSSQ thin films , since large or highly interconnected pores allow contaminants to diffuse between devices , often resulting in electrical shorts . We describe herein the properties of nanoporous MSSQ foamed from organic ...
Page 72
... foamed MSSQ . Beers ' law can then be used to determine the porosity of the foam at pore sizes that do not scatter IR radiation . Since IR porosity measurements are fast , and not easily ruined by defects or interconnected pores , they ...
... foamed MSSQ . Beers ' law can then be used to determine the porosity of the foam at pore sizes that do not scatter IR radiation . Since IR porosity measurements are fast , and not easily ruined by defects or interconnected pores , they ...
Page 73
... 40 50 60 % Polymer in Feed % Polymer in Feed Figure 5. Plots showing porosity data for samples foamed from hybrids containing various loadings of polymers 1b and 1d in MSSQ . and 1d appear to be much less susceptible to such 73.
... 40 50 60 % Polymer in Feed % Polymer in Feed Figure 5. Plots showing porosity data for samples foamed from hybrids containing various loadings of polymers 1b and 1d in MSSQ . and 1d appear to be much less susceptible to such 73.
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films