Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 117
... Glass Capillary Arrays ( GCA ) are low density columnar monolithic structures made of soda - lime glass . This structure , in which 76 % of volume between the columns , the channels , is void , also has a greatly reduced dielectric ...
... Glass Capillary Arrays ( GCA ) are low density columnar monolithic structures made of soda - lime glass . This structure , in which 76 % of volume between the columns , the channels , is void , also has a greatly reduced dielectric ...
Page 119
... Glass capillary Arrays ( GCA ) are thin plates that consist of precision , parallel glass tubes fused together into a uniform and mechanically rigid porous solid . The GCA is manufactured [ 7 ] in such a way as to give an open area of ...
... Glass capillary Arrays ( GCA ) are thin plates that consist of precision , parallel glass tubes fused together into a uniform and mechanically rigid porous solid . The GCA is manufactured [ 7 ] in such a way as to give an open area of ...
Page 208
... glass transition temperatures , adequate Young's moduli , low coefficients of thermal expansion , and low moisture outgassing rates in order for W plugs to be formed . This is a particular challenge for organic materials , although ...
... glass transition temperatures , adequate Young's moduli , low coefficients of thermal expansion , and low moisture outgassing rates in order for W plugs to be formed . This is a particular challenge for organic materials , although ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films