Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 155
... heat need to be measured . The thermal conductivity κ can be obtained as к = λpC , where λ is thermal diffusivity , p ... heating problem for polymer / Al interconnect structures at high current density . In a typical chip measuring 1 cm ...
... heat need to be measured . The thermal conductivity κ can be obtained as к = λpC , where λ is thermal diffusivity , p ... heating problem for polymer / Al interconnect structures at high current density . In a typical chip measuring 1 cm ...
Page 313
... heating , the effect of heat dissipation . The observed value of n = -2 even in a low current density region for the Cu / PI case was probably due to the poor thermal conductivity of polyimide . When extrapolating to use condition from ...
... heating , the effect of heat dissipation . The observed value of n = -2 even in a low current density region for the Cu / PI case was probably due to the poor thermal conductivity of polyimide . When extrapolating to use condition from ...
Page 342
... Heat dissipation difference between SiO , ILD and low - k ILD . temperature for low - k ILD rises more than that for SiO ... heating on the wiring lifetime for a - C : F ILD under highly accelerated stress conditions at the substrate ...
... Heat dissipation difference between SiO , ILD and low - k ILD . temperature for low - k ILD rises more than that for SiO ... heating on the wiring lifetime for a - C : F ILD under highly accelerated stress conditions at the substrate ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films