Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 12
... improve mechanical strength and thermal conductivity as well as to provide a sacrificial dielectric for CMP ... improvement in thermal conductivity can be provided by using the previously discussed embedded low k dielectric architecture ...
... improve mechanical strength and thermal conductivity as well as to provide a sacrificial dielectric for CMP ... improvement in thermal conductivity can be provided by using the previously discussed embedded low k dielectric architecture ...
Page 65
... improves bulk resistivity and breakdown field strength in contrast with other low k processes . One interesting ... improved resistivity and breakdown field strength and constant refractive index , possibly resulted from the addition of ...
... improves bulk resistivity and breakdown field strength in contrast with other low k processes . One interesting ... improved resistivity and breakdown field strength and constant refractive index , possibly resulted from the addition of ...
Page 152
... improvement , we employ an electric modulator , replacing the original mechanical chopper . It allows us to achieve higher ... improve optical properties . This claim is supported by both experimental observation and theoretical modeling ...
... improvement , we employ an electric modulator , replacing the original mechanical chopper . It allows us to achieve higher ... improve optical properties . This claim is supported by both experimental observation and theoretical modeling ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films