Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 147
... Materials Out - of - plane In - plane Measured Predicted Dielectric Constant Dielectric Δε Δε Constant MAT1 2.65 ± 0.1 2.77 ± 0.20 0.12 0.485 MAT2 2.69 ± 0.1 2.75 ± 0.13 0.06 0.038 using MIM structures , and measured an in - plane 147.
... Materials Out - of - plane In - plane Measured Predicted Dielectric Constant Dielectric Δε Δε Constant MAT1 2.65 ± 0.1 2.77 ± 0.20 0.12 0.485 MAT2 2.69 ± 0.1 2.75 ± 0.13 0.06 0.038 using MIM structures , and measured an in - plane 147.
Page 155
... plane thermal diffusivity . The in - plane thermal diffusivity can be measured by ISTS [ 1 ] . By combining with this in - plane thermal diffusivity measurement , we can obtain a complete view of the thermal anisotropy . The data is ...
... plane thermal diffusivity . The in - plane thermal diffusivity can be measured by ISTS [ 1 ] . By combining with this in - plane thermal diffusivity measurement , we can obtain a complete view of the thermal anisotropy . The data is ...
Page 362
... in subsequent cycles . Out - of plane swelling Swelling of the polymer film perpendicular to the substrate plane is in principle governed by the same equation as in - plane - swelling , i.e. eq . ( 2 ) . However , if the humidity ...
... in subsequent cycles . Out - of plane swelling Swelling of the polymer film perpendicular to the substrate plane is in principle governed by the same equation as in - plane - swelling , i.e. eq . ( 2 ) . However , if the humidity ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films