Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page vii
... INTEGRATION OF LOW - K INTERCONNECTS * Low - Dielectric Constant Materials Integration Challenges .. 199 .... Gary W. Ray * Porous Silica Xerogel Processing and Integration for ULSI Applications Changming Jin , Scott List , and Eden ...
... INTEGRATION OF LOW - K INTERCONNECTS * Low - Dielectric Constant Materials Integration Challenges .. 199 .... Gary W. Ray * Porous Silica Xerogel Processing and Integration for ULSI Applications Changming Jin , Scott List , and Eden ...
Page 49
... Integration J. J. Yang , J. Gill , J. Kennedy , S.-Q. Wang , L. Forester and M. Ross * AlliedSignal Inc. , Advanced Microelectronics Materials , 1349 Moffett Park Drive , Sunnyvale , CA 94089 * AlliedSignal Inc. , Electron Vision ...
... Integration J. J. Yang , J. Gill , J. Kennedy , S.-Q. Wang , L. Forester and M. Ross * AlliedSignal Inc. , Advanced Microelectronics Materials , 1349 Moffett Park Drive , Sunnyvale , CA 94089 * AlliedSignal Inc. , Electron Vision ...
Page 241
Process Integration issues for Interlevel Dielectric Materials for Sub - quarter Micron Silicon Integrated Circuits Vijay Parihar and R. Singh * Center for Silicon Nanoelectronics Department of Electrical and Computer Engineering ...
Process Integration issues for Interlevel Dielectric Materials for Sub - quarter Micron Silicon Integrated Circuits Vijay Parihar and R. Singh * Center for Silicon Nanoelectronics Department of Electrical and Computer Engineering ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films