Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 3
... interconnects . INTRODUCTION The density and performance demands of device scaling have created a crisis for interconnect technology . Unlike transistor scaling , where performance can be improved with reduced gate length , scaled ...
... interconnects . INTRODUCTION The density and performance demands of device scaling have created a crisis for interconnect technology . Unlike transistor scaling , where performance can be improved with reduced gate length , scaled ...
Page 200
... Interconnect PTAB for use in the SEMATCH J105 program . Test results on a wide variety of low k dielectric material candidates can be found in the reports generated by the program . Clearly , a new material has to have a substantially ...
... Interconnect PTAB for use in the SEMATCH J105 program . Test results on a wide variety of low k dielectric material candidates can be found in the reports generated by the program . Clearly , a new material has to have a substantially ...
Page 347
... interconnects are one of the main causes for compromising speed performance in advanced ICs as interconnect dimensions are scaled down . [ 1 ] In advanced logic devices , the stack of the interlayer dielectrics has increased to five or ...
... interconnects are one of the main causes for compromising speed performance in advanced ICs as interconnect dimensions are scaled down . [ 1 ] In advanced logic devices , the stack of the interlayer dielectrics has increased to five or ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films