Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 63
... dielectric constant ( low k ) material SiO ( F , C ) . Fluorine and carbon were implanted into SiO2 films by CF4 PII using an ICP plasma reactor . The effective dielectric ... interlayer . INTRODUCTION One of the major trends in modern ...
... dielectric constant ( low k ) material SiO ( F , C ) . Fluorine and carbon were implanted into SiO2 films by CF4 PII using an ICP plasma reactor . The effective dielectric ... interlayer . INTRODUCTION One of the major trends in modern ...
Page 291
Copper damascene using low dielectric constant fluorinated amorphous carbon interlayer Y. Matsubara * , K. Endo ** M. Iguchi * , N.Ito * , K. Aoyama ** , T. Tatsumi ** , and T. Horiuchi * * ULSI Device Development Laboratories , NEC ...
Copper damascene using low dielectric constant fluorinated amorphous carbon interlayer Y. Matsubara * , K. Endo ** M. Iguchi * , N.Ito * , K. Aoyama ** , T. Tatsumi ** , and T. Horiuchi * * ULSI Device Development Laboratories , NEC ...
Page 385
... interlayer dielectrics ( ILD ) , 75 , 145 joule heating effect , 341 liquid phase deposition , 27 , 57 low ( - ) dielectric , 111 , 165 constant materials , 63 , 93 , 277 materials , 93 k , 27 , 57 , 139 , 247 , 329 , 317 , 371 dielectric ...
... interlayer dielectrics ( ILD ) , 75 , 145 joule heating effect , 341 liquid phase deposition , 27 , 57 low ( - ) dielectric , 111 , 165 constant materials , 63 , 93 , 277 materials , 93 k , 27 , 57 , 139 , 247 , 329 , 317 , 371 dielectric ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines Microelectronics modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films