Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 63
... Materials Science , City University of Hong Kong , 83 Tat Chee Avenue , Kowloon , Hong Kong ABSTRACT Plasma ion implantation ( PII ) doping technique has been utilized to prepare a new low- dielectric constant ( low k ) material SiO ( F ...
... Materials Science , City University of Hong Kong , 83 Tat Chee Avenue , Kowloon , Hong Kong ABSTRACT Plasma ion implantation ( PII ) doping technique has been utilized to prepare a new low- dielectric constant ( low k ) material SiO ( F ...
Page 125
... low k materials . Studies on several ion beam analysis techniques will be discussed . Rutherford Backscattering Spectrometry ( RBS ) provides a very powerful analytical technique for the thickness and porosity measurements on porous ...
... low k materials . Studies on several ion beam analysis techniques will be discussed . Rutherford Backscattering Spectrometry ( RBS ) provides a very powerful analytical technique for the thickness and porosity measurements on porous ...
Page 151
... materials Science and Engineering , Univ . of Texas at Austin , Austin TX 78712 ABSTRACT In this paper , we present ... low K dielectric medium materials and SiO2 suggests that greater attention should be paid to thermal properties for ...
... materials Science and Engineering , Univ . of Texas at Austin , Austin TX 78712 ABSTRACT In this paper , we present ... low K dielectric medium materials and SiO2 suggests that greater attention should be paid to thermal properties for ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films