Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 7
Typical interconnect architectures for insertion of low k dielectrics are shown in Figure 6. While a homogeneous dielectric may offer more process simplicity , integration issues must also be taken into account , as will be discussed in ...
Typical interconnect architectures for insertion of low k dielectrics are shown in Figure 6. While a homogeneous dielectric may offer more process simplicity , integration issues must also be taken into account , as will be discussed in ...
Page 10
... LOW K DIELECTRICS Numerous low k organic and inorganic materials spanning a wide range of dielectric constant , from air ( k = 1 ) to fluorinated oxides ( k ~ 3.6 ) have been successfully integrated into interconnect systems [ 6 ] ...
... LOW K DIELECTRICS Numerous low k organic and inorganic materials spanning a wide range of dielectric constant , from air ( k = 1 ) to fluorinated oxides ( k ~ 3.6 ) have been successfully integrated into interconnect systems [ 6 ] ...
Page 12
... low k dielectrics , integration of polymeric materials into aluminum [ 8 ] and copper [ 9 ] metallization systems ... LOW K DIELECTRICS In general , low k dielectrics exhibit less mechanical strength and poor thermal conductivity ( 20-30 ...
... low k dielectrics , integration of polymeric materials into aluminum [ 8 ] and copper [ 9 ] metallization systems ... LOW K DIELECTRICS In general , low k dielectrics exhibit less mechanical strength and poor thermal conductivity ( 20-30 ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films