Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 120
FAR - INFRARED MEASUREMENTS We have previously reported on measurements of the far - infrared transmission of thick ( 100 μm ) samples of 10 - μm diameter GCA [ 8 ] . Infrared absorption spectra were measured with a Bomem FTIR DA8 ...
FAR - INFRARED MEASUREMENTS We have previously reported on measurements of the far - infrared transmission of thick ( 100 μm ) samples of 10 - μm diameter GCA [ 8 ] . Infrared absorption spectra were measured with a Bomem FTIR DA8 ...
Page 151
... measurements were conducted for bulk materials , we have developed an on - wafer photothermal measurement for thin films . There are many advantages for the on - wafer measurement . First , with support from a solid wafer , it is much ...
... measurements were conducted for bulk materials , we have developed an on - wafer photothermal measurement for thin films . There are many advantages for the on - wafer measurement . First , with support from a solid wafer , it is much ...
Page 154
... measurements [ 2 ] . The optical measurements of the birefringence are shown in Table 1. We can see that the optical anisotropy of BPDA - PDA is significantly greater than that of PMDA - ODA . This suggests the PMDA - ODA molecular ...
... measurements [ 2 ] . The optical measurements of the birefringence are shown in Table 1. We can see that the optical anisotropy of BPDA - PDA is significantly greater than that of PMDA - ODA . This suggests the PMDA - ODA molecular ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films