Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 122
... ( 1968 ) . H. Altshuler in " Handbook of Microwave Measurements " 3th ed , Edited by M. Sucher and J. Fox ( Interscience , New York , 1963 ) , pp . 533 . Part II Metrology and Characterization for Low - K Dielectrics 122.
... ( 1968 ) . H. Altshuler in " Handbook of Microwave Measurements " 3th ed , Edited by M. Sucher and J. Fox ( Interscience , New York , 1963 ) , pp . 533 . Part II Metrology and Characterization for Low - K Dielectrics 122.
Page 165
... microwave dielectric losses and the width of first order phonon lines in a sequence of BMT → SAT → SAN ceramics with increasing phonon damping . Moreover , the phonon damping decreases in materials with non - close - packed structure ...
... microwave dielectric losses and the width of first order phonon lines in a sequence of BMT → SAT → SAN ceramics with increasing phonon damping . Moreover , the phonon damping decreases in materials with non - close - packed structure ...
Page 170
... microwave dielectrics . CONCLUSION Comparative study of 1 : 1 ( SAT and SAN ) and 1 : 2 ( BMT ) complex perovskites with low dielectric losses enabled us to find a simple correlation between the phonon spectra and the real structure ...
... microwave dielectrics . CONCLUSION Comparative study of 1 : 1 ( SAT and SAN ) and 1 : 2 ( BMT ) complex perovskites with low dielectric losses enabled us to find a simple correlation between the phonon spectra and the real structure ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films