Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 330
... moisture or other chemical species . The moisture related stress corrosion effects in various bulk materials have long been recognized . At a crack tip , the bond rupture process is facilitated by the presence of moisture . For example ...
... moisture or other chemical species . The moisture related stress corrosion effects in various bulk materials have long been recognized . At a crack tip , the bond rupture process is facilitated by the presence of moisture . For example ...
Page 331
... moisture can diffuse from the edge to the interior interface regions . Despite the importance , there is little data available on interface moisture diffusion , primarily because there is no analytical tools available that is sensitive ...
... moisture can diffuse from the edge to the interior interface regions . Despite the importance , there is little data available on interface moisture diffusion , primarily because there is no analytical tools available that is sensitive ...
Page 338
... moisture , an interface can be weakened to the extent that a very small drying force is sufficient to debond it . For low - K polymer materials , the moisture effects are particularly severe because moisture can easily reach the ...
... moisture , an interface can be weakened to the extent that a very small drying force is sufficient to debond it . For low - K polymer materials , the moisture effects are particularly severe because moisture can easily reach the ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films