Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 22
... molecular weight molecules from the polymer bulk to the surface , where theses molecules cover metal clusters to reduce their high surface energy ” . 76 In order to demonstrate the absence of diffusion from a continuous metal film we ...
... molecular weight molecules from the polymer bulk to the surface , where theses molecules cover metal clusters to reduce their high surface energy ” . 76 In order to demonstrate the absence of diffusion from a continuous metal film we ...
Page 41
... molecules comprised of fused ( SiO1.5 ) n rings or polygons with Si atoms at the vertices and O atoms at the midpoints of the edges . For these molecules , the geometry and normal mode vibrational spectra were calculated using a hybrid ...
... molecules comprised of fused ( SiO1.5 ) n rings or polygons with Si atoms at the vertices and O atoms at the midpoints of the edges . For these molecules , the geometry and normal mode vibrational spectra were calculated using a hybrid ...
Page 363
... molecule with an effective vol- ume of 30Å3 [ 8 ] causes a volume increase of about 10 to 15 Å3 , very similar results were reported in [ 8 ] . From these and previous investigations [ 3 ] [ 4 ] it can be concluded that water molecules ...
... molecule with an effective vol- ume of 30Å3 [ 8 ] causes a volume increase of about 10 to 15 Å3 , very similar results were reported in [ 8 ] . From these and previous investigations [ 3 ] [ 4 ] it can be concluded that water molecules ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films