Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 93
... monomers . The dielectric constants of the films decrease as the plasma duty cycles employed during polymerization are decreased . Although the as deposited films exhibit relatively poor thermal stability , it was discovered that post ...
... monomers . The dielectric constants of the films decrease as the plasma duty cycles employed during polymerization are decreased . Although the as deposited films exhibit relatively poor thermal stability , it was discovered that post ...
Page 95
examples of these changes for films obtained from PFS monomer . The XPS peak assignments shown are in accord with previous studies of fluorocarbon monomers [ 6 ] . The high resolution C ( 1s ) XPS spectra of these polymers show a ...
examples of these changes for films obtained from PFS monomer . The XPS peak assignments shown are in accord with previous studies of fluorocarbon monomers [ 6 ] . The high resolution C ( 1s ) XPS spectra of these polymers show a ...
Page 97
... monomer . Dramatic improvements in the thermal stabilities of these films were observed after the curing process . An example of this improved thermal stability is shown in Figure 5 , in which TGA analysis of an as deposited and an film ...
... monomer . Dramatic improvements in the thermal stabilities of these films were observed after the curing process . An example of this improved thermal stability is shown in Figure 5 , in which TGA analysis of an as deposited and an film ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films