Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 3
... performance . While traditional transistor scaling has thus far met this challenge , interconnect scaling has become the performance - limiting factor for new designs . Both interconnect resistance and capacitance play key roles in ...
... performance . While traditional transistor scaling has thus far met this challenge , interconnect scaling has become the performance - limiting factor for new designs . Both interconnect resistance and capacitance play key roles in ...
Page 10
... performance goals without utilizing low k dielectrics . Still , some companies have introduced low k dielectrics into production , and the list , driven by density and performance needs , is rapidly growing . One example of a production ...
... performance goals without utilizing low k dielectrics . Still , some companies have introduced low k dielectrics into production , and the list , driven by density and performance needs , is rapidly growing . One example of a production ...
Page 151
... performance . After the discussion of thermal conductivity measurement , we will discuss briefly the impact of the thermal performance in integrating low K materials . To study the thermal properties of these materials and structures ...
... performance . After the discussion of thermal conductivity measurement , we will discuss briefly the impact of the thermal performance in integrating low K materials . To study the thermal properties of these materials and structures ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films