Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 5
... planarization for electrical isolation . In the alternative damascene approach , holes and / or grooves are formed in the dielectric and then filled with metal , which is subsequently planarized by chemical mechanical polish ( CMP ) . A ...
... planarization for electrical isolation . In the alternative damascene approach , holes and / or grooves are formed in the dielectric and then filled with metal , which is subsequently planarized by chemical mechanical polish ( CMP ) . A ...
Page 53
... planarization and thermal budget requirements for pre - metal dielectric layers are extremely critical . Typically , planarization is achieved by BPSG reflow or with BPSG reflow followed by a total etchback SOP process . BPSG reflow ...
... planarization and thermal budget requirements for pre - metal dielectric layers are extremely critical . Typically , planarization is achieved by BPSG reflow or with BPSG reflow followed by a total etchback SOP process . BPSG reflow ...
Page 202
... planarization . Organic spin - on polymers are generally capable of longer range planarization than the SOG's , but none of them provide planarization on the same scale as CMP . The planarization properties of a given film depend upon ...
... planarization . Organic spin - on polymers are generally capable of longer range planarization than the SOG's , but none of them provide planarization on the same scale as CMP . The planarization properties of a given film depend upon ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films