Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 202
... rate , and rate of crosslinking . Two different polymers of the same ... polish as they are not readily soluble in solvent systems that are ... polish rate . MATERIALS 13 12 11 The materials that have been developed and tested for use as ...
... rate , and rate of crosslinking . Two different polymers of the same ... polish as they are not readily soluble in solvent systems that are ... polish rate . MATERIALS 13 12 11 The materials that have been developed and tested for use as ...
Page 228
... polishing blanket wafers , rates can be determined and the need for a CMP polish stop can be evaluated . The polish rates of DLC , with dielectric constants of 2.7-3.0 , in the metal polish process are shown in Table III . They are ...
... polishing blanket wafers , rates can be determined and the need for a CMP polish stop can be evaluated . The polish rates of DLC , with dielectric constants of 2.7-3.0 , in the metal polish process are shown in Table III . They are ...
Page 282
... polish rate of the benzoclobutene TM 5021-32 ( BCB ) from Dow Chemical Company as a function of the volume percent of the surfactant Triton - X added to the slurry which consisted of 1 volume % HNO , and 1 weight percent 60 nm or 300 nm ...
... polish rate of the benzoclobutene TM 5021-32 ( BCB ) from Dow Chemical Company as a function of the volume percent of the surfactant Triton - X added to the slurry which consisted of 1 volume % HNO , and 1 weight percent 60 nm or 300 nm ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films