Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 15
... polymer surfaces deviate markedly from unity . Diffusion into the polymer increases strongly at low deposition rates . No significant diffusion is expected from a continuous metal film unless metal ions are formed at the interface ...
... polymer surfaces deviate markedly from unity . Diffusion into the polymer increases strongly at low deposition rates . No significant diffusion is expected from a continuous metal film unless metal ions are formed at the interface ...
Page 16
... polymer surface . However , during the initial stage of polymer metallization the conditions are far from thermodynamic equilibrium . Here the virgin polymer surface is exposed to isolated metal atoms that do not have to overcome the ...
... polymer surface . However , during the initial stage of polymer metallization the conditions are far from thermodynamic equilibrium . Here the virgin polymer surface is exposed to isolated metal atoms that do not have to overcome the ...
Page 73
... polymer in MSSQ . The squares represent data for polymer 1b , while the Xs represent data for polymer 1c . 6 8 10 12 Degree of Polymerization Figure 4. Domain size vs. degree of polymerization for the 30 % loading ( w / w ) of each ...
... polymer in MSSQ . The squares represent data for polymer 1b , while the Xs represent data for polymer 1c . 6 8 10 12 Degree of Polymerization Figure 4. Domain size vs. degree of polymerization for the 30 % loading ( w / w ) of each ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films