Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 177
... polymer thin films of a few microns thick . [ 5-7 ] Recently this quartz crystal microbalance technique has been modified for measuring the mechanical properties of sub - micron polymer films with high precision . The details and ...
... polymer thin films of a few microns thick . [ 5-7 ] Recently this quartz crystal microbalance technique has been modified for measuring the mechanical properties of sub - micron polymer films with high precision . The details and ...
Page 183
... Polymer thin films ( less than 20 μm ) are widely used as coatings and inter - level dielectrics in microelectronic applications . In multi - layer structures , stresses generated in the films due to interaction with adjacent layers and ...
... Polymer thin films ( less than 20 μm ) are widely used as coatings and inter - level dielectrics in microelectronic applications . In multi - layer structures , stresses generated in the films due to interaction with adjacent layers and ...
Page 297
... polymeric films have been formed by electron beam bombardment ( 500eV ) of molecularly adsorbed vinyl silane precursors under ultra - high vacuum ( UHV ) conditions . Temperature programmed desorption ( TPD ) studies show that ...
... polymeric films have been formed by electron beam bombardment ( 500eV ) of molecularly adsorbed vinyl silane precursors under ultra - high vacuum ( UHV ) conditions . Temperature programmed desorption ( TPD ) studies show that ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films