Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 16
... polymers is generally very weak in comparison to the strong metal - metal binding forces . As a consequence , the solubility of those metals in polymers should be extremely low un- der equilibrium conditions , and practically no ...
... polymers is generally very weak in comparison to the strong metal - metal binding forces . As a consequence , the solubility of those metals in polymers should be extremely low un- der equilibrium conditions , and practically no ...
Page 139
... polymeric material ( k < 3.0 ) . Unlike SiO2 , polymeric thin films exhibit a complex morphology which varies with the polymer's thermal history , deposition temperature , and film thickness . Since the morphology of the polymer thin ...
... polymeric material ( k < 3.0 ) . Unlike SiO2 , polymeric thin films exhibit a complex morphology which varies with the polymer's thermal history , deposition temperature , and film thickness . Since the morphology of the polymer thin ...
Page 297
... polymeric films have been formed by electron beam bombardment ( 500eV ) of molecularly adsorbed vinyl silane ... polymeric materials has raised issues regarding the adhesion of the polymer to Cu or other metal substrates , and the ...
... polymeric films have been formed by electron beam bombardment ( 500eV ) of molecularly adsorbed vinyl silane ... polymeric materials has raised issues regarding the adhesion of the polymer to Cu or other metal substrates , and the ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films