Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 15
... polymers in general and particularly with respect to the new low - k polymers . INTRODUCTION Although metallized plastics have since long been used in many products , research into the field of metal - polymer interfaces was mainly ...
... polymers in general and particularly with respect to the new low - k polymers . INTRODUCTION Although metallized plastics have since long been used in many products , research into the field of metal - polymer interfaces was mainly ...
Page 16
... polymers should be extremely low un- der equilibrium conditions , and practically no intermixing should occur when a ... polymers from continuous metal films such as conduction lines . Moreover , the influence of metal - polymer inter ...
... polymers should be extremely low un- der equilibrium conditions , and practically no intermixing should occur when a ... polymers from continuous metal films such as conduction lines . Moreover , the influence of metal - polymer inter ...
Page 278
... polymer as the interlayer dielectric [ 4 , 6-11 ] . POLYMER PROPERTIES : CMP RELATED NEEDS AND CRITERIA Polymers are long - chain macromolecules with a repeating monomer . As the monomers link together during polymerization , the ...
... polymer as the interlayer dielectric [ 4 , 6-11 ] . POLYMER PROPERTIES : CMP RELATED NEEDS AND CRITERIA Polymers are long - chain macromolecules with a repeating monomer . As the monomers link together during polymerization , the ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films