Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 215
... porous silica xerogel films contain a large amount Si - OH groups at their pore surfaces and readily adsorb water [ 4 ] . Due to their high porosity and large surface areas , the moisture content in porous silica xerogel films can be ...
... porous silica xerogel films contain a large amount Si - OH groups at their pore surfaces and readily adsorb water [ 4 ] . Due to their high porosity and large surface areas , the moisture content in porous silica xerogel films can be ...
Page 216
... porous silica xerogel films . a ) An untreated film with absorbed water peaks . b ) A surface modified film showing the absence of absorbed water peaks . Porous silica xerogel films from 150 nm to over one micron in thickness are ...
... porous silica xerogel films . a ) An untreated film with absorbed water peaks . b ) A surface modified film showing the absence of absorbed water peaks . Porous silica xerogel films from 150 nm to over one micron in thickness are ...
Page 218
for 30 minutes . The porosity and thickness of the porous silica xerogel films are measured using an ellipsometer before and after the process . The porous silica xerogel film maintained its porosity and thickness . PROCESS INTEGRATION ...
for 30 minutes . The porosity and thickness of the porous silica xerogel films are measured using an ellipsometer before and after the process . The porous silica xerogel film maintained its porosity and thickness . PROCESS INTEGRATION ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films