Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 215
... silica xerogel thin film deposition steps via sol - gel processes using spin coating . After spin - coating , the ... porous silica xerogel films contain a large amount Si - OH groups at their pore surfaces and readily adsorb water [ 4 ] ...
... silica xerogel thin film deposition steps via sol - gel processes using spin coating . After spin - coating , the ... porous silica xerogel films contain a large amount Si - OH groups at their pore surfaces and readily adsorb water [ 4 ] ...
Page 216
A FTIR spectrum of a surface modified porous silica xerogel film , Figure 3b , shows the absence of adsorbed water peaks , suggesting the film is hydrophobic . Hydrophobicity is also confirmed by water contact angle measurements . Porous ...
A FTIR spectrum of a surface modified porous silica xerogel film , Figure 3b , shows the absence of adsorbed water peaks , suggesting the film is hydrophobic . Hydrophobicity is also confirmed by water contact angle measurements . Porous ...
Page 218
for 30 minutes . The porosity and thickness of the porous silica xerogel films are measured using an ellipsometer before and after the process . The porous silica xerogel film maintained its porosity and thickness . PROCESS INTEGRATION ...
for 30 minutes . The porosity and thickness of the porous silica xerogel films are measured using an ellipsometer before and after the process . The porous silica xerogel film maintained its porosity and thickness . PROCESS INTEGRATION ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films