Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 93
... present study , this compositional controllability under pulsed conditions is illustrated with two fluoroaromatic monomers . The dielectric constants of the films decrease as the plasma duty cycles employed during polymerization are ...
... present study , this compositional controllability under pulsed conditions is illustrated with two fluoroaromatic monomers . The dielectric constants of the films decrease as the plasma duty cycles employed during polymerization are ...
Page 242
... Present tech . 1 / GAPFILL ASPECT RATIO Present tech . INCREASING WAFER SIZE PROCESSING WINDOW ( SHRINKING ) Present tech . DIELECTRIC CONSTANT Present tech . into the ever reducing processing window . Deposition of a material over ...
... Present tech . 1 / GAPFILL ASPECT RATIO Present tech . INCREASING WAFER SIZE PROCESSING WINDOW ( SHRINKING ) Present tech . DIELECTRIC CONSTANT Present tech . into the ever reducing processing window . Deposition of a material over ...
Page 372
... present paper , we studies the interactions of the Si - O - F and C - F alloy films with water molecule as function of near - neighbor Si - F and C - F bonding arrangements . Our calculations focus on the reaction energetics and ...
... present paper , we studies the interactions of the Si - O - F and C - F alloy films with water molecule as function of near - neighbor Si - F and C - F bonding arrangements . Our calculations focus on the reaction energetics and ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films