Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 121
... presented . An analytical expression has been presented for the effective complex index of refraction seen by an electromagnetic wave propagating through a GCA dielectric parallel and perpendicular to the channels . This work was ...
... presented . An analytical expression has been presented for the effective complex index of refraction seen by an electromagnetic wave propagating through a GCA dielectric parallel and perpendicular to the channels . This work was ...
Page 157
... presented . INTRODUCTION In the microelectronics industry the ever increasing need for higher performance and increased wiring density for fabricating the many levels of metal wiring used to connect the devices on the chip is the ...
... presented . INTRODUCTION In the microelectronics industry the ever increasing need for higher performance and increased wiring density for fabricating the many levels of metal wiring used to connect the devices on the chip is the ...
Page 370
... presented at the MRS Fall Meeting , Symposium H , Boston , 1996 . 5 J. A. Theil , F. Mertz , M. Yairi , K. Seaward , G. Ray , and G. Kooi , presented at the MRS Spring Meeting , Symposium N , San Francisco , 1997 . 6 S. A. Robles , L ...
... presented at the MRS Fall Meeting , Symposium H , Boston , 1996 . 5 J. A. Theil , F. Mertz , M. Yairi , K. Seaward , G. Ray , and G. Kooi , presented at the MRS Spring Meeting , Symposium N , San Francisco , 1997 . 6 S. A. Robles , L ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films