Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 151
... properties , the agreement with mechanical [ 2 ] and optical properties are also shown . The significance of different thermal performance between low K dielectric medium materials and SiO2 suggests that greater attention should be paid ...
... properties , the agreement with mechanical [ 2 ] and optical properties are also shown . The significance of different thermal performance between low K dielectric medium materials and SiO2 suggests that greater attention should be paid ...
Page 177
... properties of polymer films thinner than one micron may deviate significantly from bulk values [ 4 ] . The mechanical properties of the ultra - thin films ( sub - micron ) are experimentally difficult to determine with precision . The ...
... properties of polymer films thinner than one micron may deviate significantly from bulk values [ 4 ] . The mechanical properties of the ultra - thin films ( sub - micron ) are experimentally difficult to determine with precision . The ...
Page 183
... properties . Characterization of properties in all directions is essential for accurate electrical and mechanical design and modeling . A new technique has been developed to measure , in - situ , the through - plane ( z ) properties of ...
... properties . Characterization of properties in all directions is essential for accurate electrical and mechanical design and modeling . A new technique has been developed to measure , in - situ , the through - plane ( z ) properties of ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films