Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 65
... refractive index of the film , which was kept constant at about 1.46 . Other low k processes indicated lower refractive index when the F concentration in the dielectrics was high [ 5 ] . These unique features of SiO ( F , C ) ...
... refractive index of the film , which was kept constant at about 1.46 . Other low k processes indicated lower refractive index when the F concentration in the dielectrics was high [ 5 ] . These unique features of SiO ( F , C ) ...
Page 107
... refractive index and dielectric constant as a function of water content . These results are illustrated below for three different " dry " dielectric constant materials . The refractive index of air , water , and silica was taken as 1.00 ...
... refractive index and dielectric constant as a function of water content . These results are illustrated below for three different " dry " dielectric constant materials . The refractive index of air , water , and silica was taken as 1.00 ...
Page 270
... refractive index is not observed when Parylene - N is etched in a fluorocarbon - free discharge , for example oxygen or argon . This suggests that the change in refractive index is due to the diffusion of fluorine into the polymer as it ...
... refractive index is not observed when Parylene - N is etched in a fluorocarbon - free discharge , for example oxygen or argon . This suggests that the change in refractive index is due to the diffusion of fluorine into the polymer as it ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films