Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 105
... silica ( ~ 4 ) . Recently , considerable progress has been made in development of thin films of nanoporous silica for these applications . Advantages include high thermal stability , small pore size , similarity to conventional spin ...
... silica ( ~ 4 ) . Recently , considerable progress has been made in development of thin films of nanoporous silica for these applications . Advantages include high thermal stability , small pore size , similarity to conventional spin ...
Page 116
... Silica Bodies Gelled from Silica Sol - Alkali Silicate Mixtures " , Colloid and Interface Science , Vol . 3 : 63-69 , 1976 3 - W. Cao , R. Gerhardt and J.B. Wachtman , Jr. , “ Low Permitivity Porous Silica by a Colloidal Processing ...
... Silica Bodies Gelled from Silica Sol - Alkali Silicate Mixtures " , Colloid and Interface Science , Vol . 3 : 63-69 , 1976 3 - W. Cao , R. Gerhardt and J.B. Wachtman , Jr. , “ Low Permitivity Porous Silica by a Colloidal Processing ...
Page 216
... silica xerogel films . a ) An untreated film with absorbed water peaks . b ) A surface modified film showing the absence of absorbed water peaks . Porous silica xerogel films from 150 nm to over one micron in thickness are readily ...
... silica xerogel films . a ) An untreated film with absorbed water peaks . b ) A surface modified film showing the absence of absorbed water peaks . Porous silica xerogel films from 150 nm to over one micron in thickness are readily ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films