Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
From inside the book
Results 1-3 of 53
Page 41
... spectra were obtained using a Nicolet Magna - IR Spectrometer 550 coupled with Ominic Version 2.0 software at a resolution of 4 cm1 and taking 16 scans per spectrum . Dielectric measurements were carried out with a Hewlett - Packard ...
... spectra were obtained using a Nicolet Magna - IR Spectrometer 550 coupled with Ominic Version 2.0 software at a resolution of 4 cm1 and taking 16 scans per spectrum . Dielectric measurements were carried out with a Hewlett - Packard ...
Page 81
... spectra of the three films . Figure 5a shows the FTIR spectra for the 10/100 pulsed films . CF , species generally absorb from 980 - 1450 cm1 , 16 and CF2 and CF stretches can be identified in each of the spectra . Of particular ...
... spectra of the three films . Figure 5a shows the FTIR spectra for the 10/100 pulsed films . CF , species generally absorb from 980 - 1450 cm1 , 16 and CF2 and CF stretches can be identified in each of the spectra . Of particular ...
Page 148
... spectra of collected using parallel ( x direction ) and perpendicular ( y- direction ) polarizations are identical , which indicates that there is no preferred orientation of the polymer chains in the plane of the film . ATR spectra of ...
... spectra of collected using parallel ( x direction ) and perpendicular ( y- direction ) polarizations are identical , which indicates that there is no preferred orientation of the polymer chains in the plane of the film . ATR spectra of ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
41 other sections not shown
Other editions - View all
Common terms and phrases
1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films