Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
From inside the book
Results 1-3 of 35
Page 20
... spectroscopy ( XPS ) . Besides XPS , various other surface spectroscopy techniques have been applied to study metal - polymer interfacial reactions47,48 , including ultraviolet photo- electron spectroscopy ( UPS ) 10 , near - edge X ...
... spectroscopy ( XPS ) . Besides XPS , various other surface spectroscopy techniques have been applied to study metal - polymer interfacial reactions47,48 , including ultraviolet photo- electron spectroscopy ( UPS ) 10 , near - edge X ...
Page 76
... spectroscopy ( XPS ) and Fourier- transform infrared spectroscopy ( FTIR ) spectra detect only a few atomic % of oxygen in HFPO pulsed plasma films.3,4,15,16 These results indicate that the majority of oxygen which enters the pulsed ...
... spectroscopy ( XPS ) and Fourier- transform infrared spectroscopy ( FTIR ) spectra detect only a few atomic % of oxygen in HFPO pulsed plasma films.3,4,15,16 These results indicate that the majority of oxygen which enters the pulsed ...
Page 348
... spectroscopy ( FTIR ) . The change in SiOF film composition after post plasma treatment was investigated using an angle resolved x - ray photoelectron spectroscopy ( ARXPS ) . The C - V characteristics of the SiOF films were measured ...
... spectroscopy ( FTIR ) . The change in SiOF film composition after post plasma treatment was investigated using an angle resolved x - ray photoelectron spectroscopy ( ARXPS ) . The C - V characteristics of the SiOF films were measured ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
41 other sections not shown
Other editions - View all
Common terms and phrases
1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films