Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 69
... spin - cast onto a silicon 69 Mat . Res . Soc . Symp . Proc . Vol . 511 © 1998 Materials Research Society Scheme 1 Polymer Mix and Spin - Cast Cross -
... spin - cast onto a silicon 69 Mat . Res . Soc . Symp . Proc . Vol . 511 © 1998 Materials Research Society Scheme 1 Polymer Mix and Spin - Cast Cross -
Page 70
Scheme 1 Polymer Mix and Spin - Cast Cross - Linking by ramping temperature to 250 ° C Thermal Degradation of Polymer between 250 ° C to 430 ° C MSSQ wafer and thermally cured to form a highly cross - linked organic / inorganic polymer ...
Scheme 1 Polymer Mix and Spin - Cast Cross - Linking by ramping temperature to 250 ° C Thermal Degradation of Polymer between 250 ° C to 430 ° C MSSQ wafer and thermally cured to form a highly cross - linked organic / inorganic polymer ...
Page 354
... spin - coated organic low k dielectric which is cast from cyclohexanone solvent . The 10 % PAE solution was statically dispensed onto the 8 inch wafers , spread at 500 rpm for 15 seconds and thinned to the final thickness at 2000-3000 ...
... spin - coated organic low k dielectric which is cast from cyclohexanone solvent . The 10 % PAE solution was statically dispensed onto the 8 inch wafers , spread at 500 rpm for 15 seconds and thinned to the final thickness at 2000-3000 ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films