Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 49
... spin - on polymers . Using different e - beam processing schemes , one can obtain a variety of films such as a homogeneous film with modified properties from the original , a film with variable properties as a function of depth , or a ...
... spin - on polymers . Using different e - beam processing schemes , one can obtain a variety of films such as a homogeneous film with modified properties from the original , a film with variable properties as a function of depth , or a ...
Page 157
CHARACTERIZATION OF SPIN -ON GLASSES BY MICROINDENTATION . Eva E. Simonyi , K.-W. Lee , Robert F. Cook , Eric G. Liniger and James Speidell IBM Research Yorktown Heights , Kamelesh Srivastava IBM E.Fishkill . ABSTRACT Spin - on glasses ...
CHARACTERIZATION OF SPIN -ON GLASSES BY MICROINDENTATION . Eva E. Simonyi , K.-W. Lee , Robert F. Cook , Eric G. Liniger and James Speidell IBM Research Yorktown Heights , Kamelesh Srivastava IBM E.Fishkill . ABSTRACT Spin - on glasses ...
Page 202
... spin - on films . Processing conditions also have an important role . For example , if the solvent evaporates too rapidly in the spin cup , the viscosity of the film on the wafer will increase to the point where the film is no longer ...
... spin - on films . Processing conditions also have an important role . For example , if the solvent evaporates too rapidly in the spin cup , the viscosity of the film on the wafer will increase to the point where the film is no longer ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films