Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 155
... structure , some of the characteristic features are shared by both vertical and horizontal direction . In a rigid- rod - like structure , the random intra - molecule coupling through the Van der Waals forces in the out of plane ...
... structure , some of the characteristic features are shared by both vertical and horizontal direction . In a rigid- rod - like structure , the random intra - molecule coupling through the Van der Waals forces in the out of plane ...
Page 230
... structure is the impact that relatively high dielectric leakage has on interconnect structures . Electrical leakage data for MOS dots on blanket films is shown in Figure 5. Compared to silicon oxide , DLC is much less resistive , having ...
... structure is the impact that relatively high dielectric leakage has on interconnect structures . Electrical leakage data for MOS dots on blanket films is shown in Figure 5. Compared to silicon oxide , DLC is much less resistive , having ...
Page 308
... structure has negligible impact on overall circuit performance and provides several diffusion barrier layers between the Si devices and the copper interconnect structure . Certainly , no system of barrier layer will be defect - free ...
... structure has negligible impact on overall circuit performance and provides several diffusion barrier layers between the Si devices and the copper interconnect structure . Certainly , no system of barrier layer will be defect - free ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films