Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 125
... techniques have become very useful for characterization of low k materials . Studies on several ion beam analysis techniques will be discussed . Rutherford Backscattering Spectrometry ( RBS ) provides a very powerful analytical technique ...
... techniques have become very useful for characterization of low k materials . Studies on several ion beam analysis techniques will be discussed . Rutherford Backscattering Spectrometry ( RBS ) provides a very powerful analytical technique ...
Page 127
... technique . These nuclear reactions have been used in the analysis of low k materials . Detected Element Reaction Incident Energy Em itted Particle ( MeV ) Energy ( MeV ) Fluorine 19 F ( p , αy ) 160 0.3405 6.3-7.12 Hydrogen 1H ( 15N ...
... technique . These nuclear reactions have been used in the analysis of low k materials . Detected Element Reaction Incident Energy Em itted Particle ( MeV ) Energy ( MeV ) Fluorine 19 F ( p , αy ) 160 0.3405 6.3-7.12 Hydrogen 1H ( 15N ...
Page 177
... technique for measuring properties of polymer thin films of a few microns thick . [ 5-7 ] Recently this quartz crystal microbalance technique has been modified for measuring the mechanical properties of sub - micron polymer films with ...
... technique for measuring properties of polymer thin films of a few microns thick . [ 5-7 ] Recently this quartz crystal microbalance technique has been modified for measuring the mechanical properties of sub - micron polymer films with ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films