Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 151
... thermal anisotropy , the out - of - plane thermal diffusivity measured from this technique is compared with the in - plane thermal diffusivity by measured by ISTS [ 1 ] . In addition to the thermal properties , the agreement with ...
... thermal anisotropy , the out - of - plane thermal diffusivity measured from this technique is compared with the in - plane thermal diffusivity by measured by ISTS [ 1 ] . In addition to the thermal properties , the agreement with ...
Page 152
... thermal diffusion length to film thickness . The corresponding change of thermoelastic response is probed and the thermal diffusivity is derived by fitting a numerical model with experimental data . EXPERIMENTAL The experimental setup ...
... thermal diffusion length to film thickness . The corresponding change of thermoelastic response is probed and the thermal diffusivity is derived by fitting a numerical model with experimental data . EXPERIMENTAL The experimental setup ...
Page 155
... thermal diffusivity . The in - plane thermal diffusivity can be measured by ISTS [ 1 ] . By combining with this in - plane thermal diffusivity measurement , we can obtain a complete view of the thermal anisotropy . The data is shown in ...
... thermal diffusivity . The in - plane thermal diffusivity can be measured by ISTS [ 1 ] . By combining with this in - plane thermal diffusivity measurement , we can obtain a complete view of the thermal anisotropy . The data is shown in ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films