Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 139
... thin films exhibit a complex morphology which varies with the polymer's thermal history , deposition temperature , and film thickness . Since the morphology of the polymer thin film ultimately affects its properties such as its ...
... thin films exhibit a complex morphology which varies with the polymer's thermal history , deposition temperature , and film thickness . Since the morphology of the polymer thin film ultimately affects its properties such as its ...
Page 177
A NOVEL METHOD TO DETERMINE THE MECHANICAL PROPERTIES OF ULTRA - THIN FILMS . C.C.White and W.L. Wu . National Institute of Standards and Technology , Polymers Division , Gaithersburg , MD 20899 Abstract Recent ... Thin Films White and W L.
A NOVEL METHOD TO DETERMINE THE MECHANICAL PROPERTIES OF ULTRA - THIN FILMS . C.C.White and W.L. Wu . National Institute of Standards and Technology , Polymers Division , Gaithersburg , MD 20899 Abstract Recent ... Thin Films White and W L.
Page 183
... Polymer thin films ( less than 20 μm ) are widely used as coatings and inter - level dielectrics in microelectronic applications . In multi - layer structures , stresses generated in the films due to interaction with adjacent layers and ...
... Polymer thin films ( less than 20 μm ) are widely used as coatings and inter - level dielectrics in microelectronic applications . In multi - layer structures , stresses generated in the films due to interaction with adjacent layers and ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films