Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 165
... cubic perovskite structures with the suitable unit cell parameters [ 2 ] . The dielectric characteristics at microwave and radio frequencies are highly influenced by the ionic positions and changes caused by the lattice vibrations ...
... cubic perovskite structures with the suitable unit cell parameters [ 2 ] . The dielectric characteristics at microwave and radio frequencies are highly influenced by the ionic positions and changes caused by the lattice vibrations ...
Page 167
RESULTS and DISCUSSION It is well - known that in an ideal cubic perovskite structure ABO3 , belonging to the Pm3m ... unit cell [ 5-10 ] . In the case of 1 : 2 B - site compounds the origin of vibrational spectra is not quite clear ...
RESULTS and DISCUSSION It is well - known that in an ideal cubic perovskite structure ABO3 , belonging to the Pm3m ... unit cell [ 5-10 ] . In the case of 1 : 2 B - site compounds the origin of vibrational spectra is not quite clear ...
Page 170
... unit cell or pseudo - layered P3m1 ( D3d3 ) structure for the 1 : 2 ordered compounds . Moreover , the narrowness in the phonon peaks ( less anharmonicity ) in BMT reflects in the corresponding lower dielectric losses . These studies ...
... unit cell or pseudo - layered P3m1 ( D3d3 ) structure for the 1 : 2 ordered compounds . Moreover , the narrowness in the phonon peaks ( less anharmonicity ) in BMT reflects in the corresponding lower dielectric losses . These studies ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films