Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 75
... vapor deposition films have been grown from C2H2F4 , CH2F2 , and CHCIF2 . C - 1s x - ray photoelectron spectroscopy ( XPS ) indicates a prevalence of C - CF species in the films from C2H2F4 and CH2F2 , whereas CF2 species dominate the ...
... vapor deposition films have been grown from C2H2F4 , CH2F2 , and CHCIF2 . C - 1s x - ray photoelectron spectroscopy ( XPS ) indicates a prevalence of C - CF species in the films from C2H2F4 and CH2F2 , whereas CF2 species dominate the ...
Page 86
... Vapor Deposition , San Francisco , CA , 1998 . 39J . A. Theil , F. Mertz , M. Yairi , K. Seaward , G. Ray , and G. Kooi , in Thermal Stability of a- C : F , H Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor ...
... Vapor Deposition , San Francisco , CA , 1998 . 39J . A. Theil , F. Mertz , M. Yairi , K. Seaward , G. Ray , and G. Kooi , in Thermal Stability of a- C : F , H Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor ...
Page 348
... vapor deposition ( ECRCVD ) system ( AsTeX Model AX4505 ) which consisted of two chambers , a plasma generation chamber and a reaction chamber . Deposition of films was then performed under the predetermined conditions while the SiF ...
... vapor deposition ( ECRCVD ) system ( AsTeX Model AX4505 ) which consisted of two chambers , a plasma generation chamber and a reaction chamber . Deposition of films was then performed under the predetermined conditions while the SiF ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films