## Treatise on Materials Science and Technology, Volume 2; Volume 19, Part 1 |

### From inside the book

Results 1-3 of 82

Page 20

Both use counting statistics to determine the statistical error in a stress

fatigue ( Quesnel et al . , 1978 ) when many samples or test conditions must be

examined .

Both use counting statistics to determine the statistical error in a stress

**measurement**. Greater ...**measurements**are required , such as in studies offatigue ( Quesnel et al . , 1978 ) when many samples or test conditions must be

examined .

Page 33

METHODS OF LOCATION OF THE DIFFRACTION PEAK The centroid of a

diffraction peak has been used in x - ray stress

1959 ; Pike and Wilson , 1959 ; Singh and Balasingh , 1971 ; Baucum and

Ammons ...

METHODS OF LOCATION OF THE DIFFRACTION PEAK The centroid of a

diffraction peak has been used in x - ray stress

**measurements**( Ladell et al . ,1959 ; Pike and Wilson , 1959 ; Singh and Balasingh , 1971 ; Baucum and

Ammons ...

Page 182

This is in contrast to various

carriers , where entropy terms have to be ... and capture cross sections ) are

therefore based on junction

al .

This is in contrast to various

**measuring**techniques based on thermal excitation ofcarriers , where entropy terms have to be ... and capture cross sections ) are

therefore based on junction

**measurements**, such as photocapacitance ( Sah etal .

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### Contents

Principles of XRay Stress Measurement | 4 |

Control of Accuracy and Precision | 25 |

Applications | 45 |

Copyright | |

15 other sections not shown

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### Common terms and phrases

absorption addition allow alloy angle Appl applications atoms band bandgap beam broadening cause coefficients components composition concentration constant cooling cross section crystal curve defects dependent deposits depth determined developed diffraction diffusion direction discussed dislocation distribution effect electron elements employed energy error et al example excitation experimental factor field function give given grain heat important impurities increasing intensity iron laser lattice layer less magnetic material measurements Metals method Mössbauer needed neighbor observed obtained occur optical peak phase photoluminescence Phys plane position possible powder problem produce properties range rays recently recombination region relative residual stress sample semiconductors shift shown Society solid spacing specimen spectra spectrum sputtering steel strain structure studies substrate surface target technique temperature term thickness values variation X-ray