Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Results 1-3 of 78
Page 47
... glass . After the resis- tor is formed the wafer is etched anisotropically from the back , leaving only a thin membrane of glass under the resistor . Because glass is a poor thermal conductor ( whereas silicon is a good one ) , the ...
... glass . After the resis- tor is formed the wafer is etched anisotropically from the back , leaving only a thin membrane of glass under the resistor . Because glass is a poor thermal conductor ( whereas silicon is a good one ) , the ...
Page 68
... glass to silicon ( bare or oxidized ) or ( b ) silicon to sili- con simply by heating the assembly to about 300 ° C and applying a voltage . Glass can be bonded to IC chips ( c ) if the circuitry is first protected by etching a shallow ...
... glass to silicon ( bare or oxidized ) or ( b ) silicon to sili- con simply by heating the assembly to about 300 ° C and applying a voltage . Glass can be bonded to IC chips ( c ) if the circuitry is first protected by etching a shallow ...
Page 589
... Glass Coated Si Wafer ( 4 ) The electrostatic force P between the glass and the silicon is given by Force Gage ( A ) Anode 1 10,2 P = { & E2 = = 2 80 where E is the electric field in the gap . Combining eqns . ( 2 ) , ( 3 ) and ( 4 ) ...
... Glass Coated Si Wafer ( 4 ) The electrostatic force P between the glass and the silicon is given by Force Gage ( A ) Anode 1 10,2 P = { & E2 = = 2 80 where E is the electric field in the gap . Combining eqns . ( 2 ) , ( 3 ) and ( 4 ) ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
15 other sections not shown
Common terms and phrases
alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase photoresist plane plate polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus