Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Results 1-3 of 85
Page 163
... layer . Si , N4 films have high residual tensile stress which can lead to tensile cracking in thicker films . This property in conjunction with the high HF etch rate of these films limits their potential as isolation layers in ...
... layer . Si , N4 films have high residual tensile stress which can lead to tensile cracking in thicker films . This property in conjunction with the high HF etch rate of these films limits their potential as isolation layers in ...
Page 462
... layer of silicon over the sealed cavity . The thickness of this layer was verified using an SEM . After etching , it is immediately noticed that the capping layer is deflected into the cavity , indicating that the residual pressure is ...
... layer of silicon over the sealed cavity . The thickness of this layer was verified using an SEM . After etching , it is immediately noticed that the capping layer is deflected into the cavity , indicating that the residual pressure is ...
Page 527
... layer PSG spacer , it does etch much faster than a single - layer silicon dioxide spacer ; etch times for the composite spacer are adequate for microstructure fabrica- tion . A composite sacrificial spacer comprising 1.6 μm of silicon ...
... layer PSG spacer , it does etch much faster than a single - layer silicon dioxide spacer ; etch times for the composite spacer are adequate for microstructure fabrica- tion . A composite sacrificial spacer comprising 1.6 μm of silicon ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
15 other sections not shown
Common terms and phrases
alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase plane plate pole faces polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus