Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Page 40
... pattern of openings in the oxide that duplicates the metal pattern on the glass plate . In subsequent processing steps the oxide pattern serves as a mask for the etching of the underlying silicon . 1/8 0 13 ( 110 ) PLANE ( 100 ). of ...
... pattern of openings in the oxide that duplicates the metal pattern on the glass plate . In subsequent processing steps the oxide pattern serves as a mask for the etching of the underlying silicon . 1/8 0 13 ( 110 ) PLANE ( 100 ). of ...
Page 542
... pattern are formed by low pressure ( 30 mT ) reactive ion etching the CVD silicon dioxide in a CHF , ambient . A tung- sten pattern with four 0.3 μm x 0.3 μm squares in 0.6 μm thick tungsten is shown in Fig . 4 ( a ) ; these micrographs ...
... pattern are formed by low pressure ( 30 mT ) reactive ion etching the CVD silicon dioxide in a CHF , ambient . A tung- sten pattern with four 0.3 μm x 0.3 μm squares in 0.6 μm thick tungsten is shown in Fig . 4 ( a ) ; these micrographs ...
Page 594
... Pattern for capacitors . Hard bake and plasma descum Pattern for implantation . Hard bake and plasma descum 4.0 Nitride plasma etch 5.0 Leads implant with As , 55 keV , 5.0 × 1013 / cm2 6.0 7.0 used 8.0 Nitride plasma etch 9.0 Remove ...
... Pattern for capacitors . Hard bake and plasma descum Pattern for implantation . Hard bake and plasma descum 4.0 Nitride plasma etch 5.0 Leads implant with As , 55 keV , 5.0 × 1013 / cm2 6.0 7.0 used 8.0 Nitride plasma etch 9.0 Remove ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
15 other sections not shown
Common terms and phrases
alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase plane plate pole faces polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus