Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Page 40
... photoresist . Next the wafer is placed under a master mask ( a metal pattern on a glass plate ) through which it is exposed to radiation . Photoresist in exposed areas weakens and is rinsed away in a developing solution . Then the wafer ...
... photoresist . Next the wafer is placed under a master mask ( a metal pattern on a glass plate ) through which it is exposed to radiation . Photoresist in exposed areas weakens and is rinsed away in a developing solution . Then the wafer ...
Page 594
... photoresist has been hard baked . Bonding is found to be excellent after LOCOS oxidation if the process shown in Table 3 is followed . Hard bake and plasma descum of the photoresist are avoided . A smaller aperture open- ing on the ...
... photoresist has been hard baked . Bonding is found to be excellent after LOCOS oxidation if the process shown in Table 3 is followed . Hard bake and plasma descum of the photoresist are avoided . A smaller aperture open- ing on the ...
Page 634
... photoresist layers is but one method to achieve this . However , when thick photoresist processes are combined with electroplated metal technology , major advances in micromechanics can occur because the available material base expands ...
... photoresist layers is but one method to achieve this . However , when thick photoresist processes are combined with electroplated metal technology , major advances in micromechanics can occur because the available material base expands ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
15 other sections not shown
Common terms and phrases
alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase plane plate pole faces polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus