Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Page 68
... thermal bonding can be used to hermetically bond ( a ) 7740 glass to silicon ( bare or oxidized ) or ( b ) silicon to sili- con simply by heating the assembly to about 300 ° C and applying a voltage . Glass can be bonded to IC chips ( c ) ...
... thermal bonding can be used to hermetically bond ( a ) 7740 glass to silicon ( bare or oxidized ) or ( b ) silicon to sili- con simply by heating the assembly to about 300 ° C and applying a voltage . Glass can be bonded to IC chips ( c ) ...
Page 359
... thermal expansion that could be effectively used to fabricate microactuators based on silicon microelectronic processes . 2. ELECTRO - THERMAL ACTUATORS One of the earliest actuators used for temperature control applications is the ...
... thermal expansion that could be effectively used to fabricate microactuators based on silicon microelectronic processes . 2. ELECTRO - THERMAL ACTUATORS One of the earliest actuators used for temperature control applications is the ...
Page 526
... thermal cycle that is generally required to relieve the high compressive stress of as - deposited polysilicon [ 4 , 7 ] , this strain - relief cycle and its effect on the on - chip circuitry must be carefully considered . Many ...
... thermal cycle that is generally required to relieve the high compressive stress of as - deposited polysilicon [ 4 , 7 ] , this strain - relief cycle and its effect on the on - chip circuitry must be carefully considered . Many ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
15 other sections not shown
Common terms and phrases
alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase photoresist plane plate polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus