Symposium on SolderASTM International, 1956 |
Contents
Introduction | 2 |
Solders Fluxes and Techniques for Soldering Aluminum | 5 |
Ultrasonic Soldering of Aluminum | 15 |
Dip Soldering Printed Circuits | 30 |
Soldering in Semiconductor Devices | 41 |
Industrial Survey of Paste Solder Alloys | 49 |
Corrosive Fluxestheir Role in Soldering | 58 |
The Use of Rosin and Activated Rosin Fluxes | 64 |
A Method for Testing and Evaluating the Joint Properties of a Copper Line Soldered in an Aluminum Casting | 89 |
The Performance of some Soft Solders at Elevated Temperatures and Pressures | 103 |
DipSoldered Printed Circuit Joint Characteristics | 115 |
Tin Disease in Solder Type Alloys | 129 |
Gray Tin Formation in Soldered Joints Stored at Low Temperature | 149 |
Proposed Numerical Evaluation System for Soft Solders Solder Fluxes and Solderabiltiy | 159 |
Controlling Quality on Soldered Electrical Connections | 175 |
Symposium Summation | 184 |
Soldering Fluxes and Flux Principles | 71 |
NonCorrosive FluxesEValuation of Spread and Corrosion Properties | 81 |
Common terms and phrases
acid activated rosin fluxes Ammonium chloride antifreeze antimony application assembly ASTM International ASTM International www.astm.org bismuth burnishing cable groove cadmium cent cerium coating conductor connector containing control charts copper liner cored solder corrosion dip soldering dip-soldered joints effect electrical Engineer equipment evaluation exposure failure fillet height flux residue fluxing action germanium heat hydrazine hydrochloric acid impurities indicated indium inoculated Joint Soldered joint strength lead solder liquid liquidus low temperatures material melting metal method molten solder obtained organic fluxes paste alloys paste solder alloys peel strength values perature photo-etched Photoetched printed circuit production pure tin quality control radiator removed salt samples shown in Fig soft solders solder bond solder composition solder flux solder pot soldered joints soldering aluminum soldering iron soldering operation solution specific Spread Factor standard stearic acid steel surface Table tensile strength tin-lead solders tion transformation ture ultrasonic soldering wire zinc chloride