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Low Thermal Budget Processing of Organic Dielectrics
Thermal and Mechanical Properties of Low K Polymers
Dielectric Properties of Low Dielectric Constant
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absorption addition adhesion alternating annealing applications block bond bulk capacitance chemical circuit coating compared copolyimide copolymer copper cured decrease density deposition determined device effect electrical electronic etch Figure film thickness fluorinated foamed followed frequency function glass higher improve increase indicate integrated interconnect interlayer dielectric layer loss low dielectric constant lower materials measured mechanical metal method microelectronics modulus moisture monomers observed obtained organic oxide Parylene patterns peak performance permittivity planarization plasma polishing polyimide polyimide film polymer polymerization prepared presented properties range reactor reduce refractive reported requirements Research resistance sample shows silica aerogels silicon SiO2 SOG film solution solvent step stress structure studied substrate surface Table technique Technology Teflon temperature thermal thermal stability thickness thin films treatment values vapor Volume wafers weight