Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
From inside the book
Results 1-3 of 82
Page iv
... Research Society . All rights reserved . This book has been registered with Copyright Clearance Center , Inc. For further information , please contact the Copyright Clearance Center , Salem ... Materials Research Society Symposium.
... Research Society . All rights reserved . This book has been registered with Copyright Clearance Center , Inc. For further information , please contact the Copyright Clearance Center , Salem ... Materials Research Society Symposium.
Page xii
... Research SOCIETY SYMPOSIUM PROCEEDINGS Volume 352 - Materials Issues in Art and Archaeology IV , P.B. Vandiver ... MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 374 - Materials for Materials Research Society Symposium Proceedings.
... Research SOCIETY SYMPOSIUM PROCEEDINGS Volume 352 - Materials Issues in Art and Archaeology IV , P.B. Vandiver ... MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 374 - Materials for Materials Research Society Symposium Proceedings.
Page xiii
... RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 374 - Materials for Optical Limiting , R. Crane , K. Lewis , E.V. Stryland , M. Khoshnevisan , 1995 ... Materials Research Society Part I Synthesis and Characterizations METHODS AND NEEDS FOR LOW.
... RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 374 - Materials for Optical Limiting , R. Crane , K. Lewis , E.V. Stryland , M. Khoshnevisan , 1995 ... Materials Research Society Part I Synthesis and Characterizations METHODS AND NEEDS FOR LOW.
Contents
Methods | 3 |
Fluorinated Low Thermal Expansion Coefficient Polyimides | 19 |
Vapor Deposition of Very Low K Polymer Films | 45 |
Copyright | |
30 other sections not shown
Other editions - View all
Common terms and phrases
1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured decrease density device dielectric film dielectric properties electrode electromigration FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film solvent spin-coated spin-on stress substrate surface Table technique Technology TEOS/O test structure thermal stability thin films ULSI vapor deposition wet etch