Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page 105
... PTFE . However , the thermal stability of these fluorinated polymers inferior to that of the non - fluorinated ... ( PTFE ) , for example , has a low dielectric constant of 2.1 which is the lowest value in organic materials . PTFE also has ...
... PTFE . However , the thermal stability of these fluorinated polymers inferior to that of the non - fluorinated ... ( PTFE ) , for example , has a low dielectric constant of 2.1 which is the lowest value in organic materials . PTFE also has ...
Page 107
... PTFE . Table 1. Dielectric constants of hydrocarbon polymer films before and after the fluorination at a frequency of 1MHz . Polymers Dielectric Constants Before After PVdF 4.9 2.0 PVP 3.9 2.4 BCB 2.8 2.1 a - Carbon 5.7 2.0 Thermal ...
... PTFE . Table 1. Dielectric constants of hydrocarbon polymer films before and after the fluorination at a frequency of 1MHz . Polymers Dielectric Constants Before After PVdF 4.9 2.0 PVP 3.9 2.4 BCB 2.8 2.1 a - Carbon 5.7 2.0 Thermal ...
Page 110
... PTFE . The thermal stability of the fluorinated polymers was inferior to that of the non - fluorinated polymers . From the analyses of the fluorinated PVDF by XPS , we found that this is due to a decrease in the molecular weight ...
... PTFE . The thermal stability of the fluorinated polymers was inferior to that of the non - fluorinated polymers . From the analyses of the fluorinated PVDF by XPS , we found that this is due to a decrease in the molecular weight ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch