Low-dielectric Constant Materials-synthesis and Applications in Microelectronics: Symposium Held April 17-19, 1995, San Francisco, California, U.S.A.Toh-Ming Lu |
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Page iii
... . Kuan IBM T.J. Watson Research Center Yorktown Heights , New York , U.S.A. C.H. Ting SEMATECH Austin , Texas , U.S.A. MRS MATERIALS RESEARCH SOCIETY PITTSBURGH , PENNSYLVANIA ENGN TK 7571 .4691 1715 Single article reprints from this.
... . Kuan IBM T.J. Watson Research Center Yorktown Heights , New York , U.S.A. C.H. Ting SEMATECH Austin , Texas , U.S.A. MRS MATERIALS RESEARCH SOCIETY PITTSBURGH , PENNSYLVANIA ENGN TK 7571 .4691 1715 Single article reprints from this.
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... Research Center for for refractive index measurements and to P. Buchwalter , IBM Yorktown , R. Farris , UMass for helpful discussions . REFERENCES 1 . 2 . 3 . 4 . 5 . 6 . 7 . 8 . 9 . 10 . 11 . A. E. Feiring , B. C. Auman , and E. R. ...
... Research Center for for refractive index measurements and to P. Buchwalter , IBM Yorktown , R. Farris , UMass for helpful discussions . REFERENCES 1 . 2 . 3 . 4 . 5 . 6 . 7 . 8 . 9 . 10 . 11 . A. E. Feiring , B. C. Auman , and E. R. ...
Page 123
... Research , Santa Clara , CA ABSTRACT Low dielectric constant polymers offer many advantages in circuit performance , such as power dissipation , crosstalk and RC delay , when used as inter - layer dielectrics ( ILDs ) . Silicon dioxide ...
... Research , Santa Clara , CA ABSTRACT Low dielectric constant polymers offer many advantages in circuit performance , such as power dissipation , crosstalk and RC delay , when used as inter - layer dielectrics ( ILDs ) . Silicon dioxide ...
Contents
Methods | 3 |
Low Dielectric Constant Thermosetting Resins | 111 |
Low Thermal Budget Processing of Organic Dielectrics | 117 |
Copyright | |
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1995 Materials Research absorption annealing applications bond BPDA-PDA bulk c-BN capacitance chemical vapor deposition circuit coating copolymer copper cured density device dielectric film dielectric properties electrode electromigration etch rate FAST-SOG films film thickness films deposited fluorinated fluorinated polyimide frequency FTIR g/cm³ glass transition temperature h-BN helicon reactor IEEE Trans in-plane increase insulating integrated integrated circuits interlayer dielectric layer leakage current low dielectric constant lower LPD-SiO2 Materials Research Society measured mechanical properties metal microelectronics Microwave modulus moisture monomers multilevel interconnections optical organic polymers oxide Parylene patterns PECVD permittivity planarization plasma plasma treatment polish rate polyimide polyimide film polymeric materials pore Proc refractive index resin resistance resonators RTCVD-SiOF sample shown in Figure Si-O-Si silica aerogels siloxane SiO2 SiO2 film slurry SOG film spin-coated spin-on stress substrate surface Table technique Technology TEOS/O thermal stability thin films ULSI vapor deposition wet etch